2-Layer TSM-DS3 PCB with 20mil Core and Immersion Gold Finish
The 2-Layer TSM-DS3 PCB is a high-performance printed circuit board engineered for applications requiring excellent thermal stability, low loss, and high-frequency capabilities. Designed with TSM-DS3, a ceramic-filled, low fiberglass content material, this PCB ensures superior reliability for demanding environments such as radar systems, phased array antennas, and semiconductor testing. With its 0.6mm finished thickness, 1oz copper weight, and immersion gold finish, this PCB is ideal for high-power and high-frequency applications.
PCB Construction Details
| Specification | Details |
| Base Material | TSM-DS3 |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 96mm x 130mm ± 0.15mm |
| Finished Thickness | 0.6mm |
| Copper Thickness | 1oz (35μm) finished copper on outer layers |
| Surface Finish | Immersion Gold |
| Minimum Trace/Space | 6/5 mils |
| Minimum Hole Size | 0.25mm |
| Via Plating Thickness | 20μm |
| Solder Mask | Green on top, none on bottom |
| Silkscreen | White on top, none on bottom |
| Electrical Testing | 100% prior to shipment |
| Compliance Standard | IPC-Class-2 |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper Foil (1oz) | 35μm |
| Core | TSM-DS3 | 0.508mm (20mil) |
| Copper Layer 2 | Copper Foil (1oz) | 35μm |
PCB Statistics
| Parameter | Value |
| Components | 62 |
| Total Pads | 134 |
| Thru-Hole Pads | 69 |
| Top SMT Pads | 65 |
| Bottom SMT Pads | 0 |
| Vias | 94 |
| Nets | 2 |
The Gerber RS-274-X format ensures compatibility with modern PCB fabrication processes, and the board meets IPC-Class-2 standards, ensuring high quality and reliability for critical applications.
Material Overview: TSM-DS3
TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content (approximately 5%). It offers a combination of low dielectric constant (Dk) and low dissipation factor (Df), making it perfect for high-frequency and high-power applications. It is also designed to perform exceptionally well in thermal cycling and heat dissipation due to its high thermal conductivity and low moisture absorption.
| Property | Value |
| Dielectric Constant (Dk) | 3.0 ± 0.05 at 10GHz |
| Dissipation Factor (Df) | 0.0014 at 10GHz |
| Thermal Conductivity | 0.65 W/mK |
| Moisture Absorption | 0.07% |
| CTE (X/Y/Z) | 10ppm/°C, 16ppm/°C, 23ppm/°C |
| Temperature Stable Dk | ±0.25% from -30°C to 120°C |
| Flammability | UL 94 V-0 |
Key Features:
- Dielectric Constant (Dk): 3.0 with a tight tolerance of ±0.05 at 10GHz.
- Dissipation Factor (Df): 0.0014 at 10GHz for low-loss performance.
- High Thermal Conductivity: 0.65 W/mK for effective heat dissipation.
- Low Moisture Absorption: 0.07%, ensuring reliability in humid environments.
- Thermal Stability: Temperature-stable Dk (±0.25%) over a wide range of -30°C to 120°C.
Key Benefits:
- Low Fiberglass Content (~5%): Ideal for achieving excellent dimensional stability, rivaling epoxy-based PCBs.
- Ease of Manufacturing: Enables consistent, high-yield fabrication of complex PCBs.
- High Power Capability: Superior thermal conductivity for demanding power applications.
- Environmentally Friendly: Halogen-free and compliant with green standards.
Applications
Phased array antennas, radar manifolds
mmWave antennas for advanced driver-assistance systems (ADAS)
Radar systems, couplers
Drilling equipment requiring thermal stability
Automated test equipment (ATE) testing
Conclusion
The 2-Layer TSM-DS3 PCB with 20mil Core and Immersion Gold Finish is a premium solution for high-frequency and high-power applications. Its low-loss properties, thermal stability, and dimensional reliability make it suitable for critical designs in radar systems, phased array antennas, and semiconductor testing. With its TSM-DS3 core, this PCB guarantees consistent and reliable performance under extreme thermal and environmental conditions. For engineers seeking a robust and efficient solution, this PCB is a trusted choice backed by worldwide availability and compliance with IPC-Class-2 standards.
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lowfiberglass content material TSM-DS3 2-Layer PCB with 20mil Core and Immersion Gold Finish Images
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